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Aremco’s high temperature ceramic adhesives are unique inorganic formulations for
bonding and sealing ceramics, metals, quartz, graphites, textiles and composite
materials used in design, process and maintenance applications to 3200 °F. These
advanced materials, which exhibit high thermal and electrical resistance, enable
engineers to solve problems that were impossible previously using conventional
epoxies and other organic-based products.苏州固盛颢贸易有限公司
Ultra High Temperature
526N Clear-Amber, 1:1 System for Tough Bonding Applications.
570 Single-Part Contact Adhesive, Excellent Flexibility.
805 Aluminum-Filled, Low Shrinkage, High Thermal Conductivity, For Bonding
and Molding Applications.

2330 Single-Part, Heat Curable, Silicone Elastomer Adhesive.
High Temperature, Special Purpose
568 Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
631 Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.
657 Stainless Steel-Filled, High Corrosion Resistance.
807 10 Minute Set, Non-Sagging, 1:1, Excellent Electrical &
Mechanical Properties.
820 Clear, 1:1, 45-Minute Cure System with Good Flexibility.
2150 Ceramic-Filled, Fast-Setting, High Vibration Resistance and Bond Strength.
Ideal for bonding ceramic wear tiles.
2315 High Temperature, Thermally Conductive, Low Viscosity, Potting Compound
for Electrical Applications.
2318 High Temperature, Low Viscosity, Room Temp Curing Potting Compound.
High Temperature, Maintenance and Repair
2200 Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac,
High Strength, Excellent Abrasion and Corrosion Resistance.
2210 Aluminum and Ceramic-Filled, Vibration and Impact Resistant,
For Repairing Aluminum Mold and Wear Surfaces.
2220 Ceramic-Filled, High Chemical Resistance, Machinable,
For Repairing Deeply-Corroded Parts.
Ultra High Bond Strength
2300 Milky Clear, 10:1, Low Viscosity, Exceptional Bond Strength.
2310 Ceramic-Filled, 1:1, High Lap Shear and Peel Strength, Autoclavable.